The wafer level fully automatic vacuum transfer system is a commercial solution for the transfer of low dimensional material heterojunction devices. It is suitable for precise fixed-point transfer of materials such as graphene, molybdenum sulfide, black phosphorus, as well as the preparation of multi-layer van der Waals heterojunctions. It supports 12 inch wafer transfer and achieves fully automated mass production transfer in 3 minutes per wafer. The full vacuum process ensures ultra-high cleanliness of the transferred materials, and the AI high-precision self alignment algorithm is used to achieve perfect stacking of two-dimensional materials. The combination of high stability and precision mechanical design with high-quality microscopy imaging systems enables precise transfer of wafer level samples.

System features:

Supports large-sized wafers: 2-12 inches

Fully automated mass production: 25 minutes/piece

Full vacuum process (vacuum degree<1E-7 mbar)

AI high-precision self alignment algorithm: real-time monitoring with dual cameras

Control mode: PLC+upper computer (Windows system)

Support linkage with optical detection equipment and in-situ monitoring systems